Chip Packaging 2.0 Solutions
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MirrorSemiTM offers unique semiconductor packaging solutions for:
•Air cavity stackable packages.
•MEMS, RF and silicon packages.
•NL Core for superior BGA substrates.
•Interposers / adaptors sunset devices to legacy boards.
•Microwave and millimeter wave antennas.

  More Products >>>        What is Chip Packaging 2.0?

  Chip Packaging 2.0 Products & Services: 

  • AnyChipTM 
    • Interposer adaptors to replace sunset devices on PC boards.
  • MirrorChipTM 
    • Reverse pinout IC packaging.
  • OpenChipTM 
    • Air cavity IC packages for silicon, RF and MEMS.
  • StackChipTM 
    • PiP - Package in Package stacking solutions for FLASH and DDR2.
  • DieSocketTM 
    • - Low cost QFN test sockets for silicon die.
  • UDPo User Definable Pinouts 
    • Co-design optimize PC board re-mapping legacy chip pinouts.

     



    Mirror Semiconductor, Inc.
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800   •   Fax: 1-714-242-1770
    email: info@MirrorSemi.com

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