Chip Packaging Solutions
User Definable Pinout UDPo
for Optimum Board Performance
Products   News Release   Partners   Management   Contact  

 

MirrorSemiTM offers unique semiconductor packaging solutions for:
•Memory stacking   •Stackable MEMS packaging   •Mirrored Pinouts
•UDPo - User Definable Pinouts   •Adaptors for legacy and sunset devices  

  More Products >>>        PowerPoint Story

  Chip Packaging 2.0 Products & Services: 

  • AnyChipTM 
    • Adaptors and interposers for legacy and sunset devices.
  • MirrorChipTM 
    • Reverse pinout IC packaging.
  • OpenChipTM 
    • Air Cavity IC package for Silicon and MEMS.
  • StackChipTM 
    • PoP Stacking solutions for FLASH and DDR2.
  • UDPo User Definable Pinouts 
    • Co-design optimization of PC board while re-mapping pinouts of legacy chips.

     



    Mirror Semiconductor, Inc.
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800   •   Fax: 1-714-242-1770
    email: info@MirrorSemi.com

    ©2008 Mirror Semiconductor. All Rights Reserved.