F-QFN
Fully Open Cavity

Air Cavity QFN Substrate
RF, MEMS & Semiconductor
 
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F-QFN series air cavity (fully open cavity) QFN packages offer rapid prototype builds. Excellent for fabless semiconductors, RF-Microwave, and MEMS. Use for R&D, probing, laboratory projects and pre-production.

F-QFN lead frame substrates can be delivered quickly. Cover with telescoping dome lids or encapsulate by dispensing glob top over the die cavity. Great for fabless prototyping and pre-production requirements.

Features to suit your specific packaging needs:
  • Pads plated with NiPdAu for gold or aluminum wire-bonding.
  • SMT RoHS lead-free soldering.
  • Usable at RF Microwave.


  • F-QFN Series
  • Wire Bondable
  • RoHS SMT Pb-Free
  • Cover with Dome Lid Cap
  • Seal with Glob Top
  • Click for enlarged photo
    Top side shown with die and wire bonds
    Bottom side after encapsulating
    Bottom SMT Pads
    Shown after encapsulation
    Outline Drawing Array Outline X-Wire Ready
    Bonding Pad Table Bonding Pad Outline Cavity Dam Material-FP4451TD

    Cavity Fill Material-FP4450
     
     
     
     

    F-QFN AIR Cavity QFN
    Square Body (Standard Packages)
    N
    Leads
    P
    Pitch
    D/E
    Body
    D1/E2
    Die Pad
    Qty
    2" Waffle
    Pack
    Qty
    Array
    Part Number Outline
    Drawing
    Bonding
    Diagram
    8 0.65mm 3mm 1mm 100 256 F-QFN8W.65 460810 460814
    16 0.5mm 3mm 1mm 100 256 F-QFN16W.5 451610 451614
    16 0.65mm 4mm 2mm 64 144 F-QFN16W.65 461610 461614
    20 0.5mm 4mm 2mm 64 144 F-QFN20W.5 452010 452014
    20 0.65mm 5mm 3mm 36 81 F-QFN20W.65 462010 462014
    24 0.5mm 4mm 2mm 64 144 F-QFN24W.5 452410 452414
    28 0.5mm 5mm 3mm 36 81 F-QFN28W.5 452810 452814
    32 0.5mm 5mm 3mm 36 81 F-QFN32W.5 453210 453214
    40 0.5mm 6mm 4mm 25 64 F-QFN40W.5 454010 454014
    48 0.5mm 7mm 5mm 25 49 F-QFN48W.5 454810 454814
    52 0.5mm 8mm 6mm 16 36 F-QFN52W.5 455210 455214
    56 0.5mm 8mm 6mm 16 36 F-QFN56W.5 455610 455614
    64 0.5mm 9mm 7mm 16 25 F-QFN64W.5 456410 456414
    68 0.5mm 10mm 8mm 9 25 F-QFN68W.5 456810 456814
    72 0.5mm 10mm 8mm 9 25 F-QFN72W.5 457210 457214
    80 0.5mm 12mm 10mm 9 16 F-QFN80W.5 458010 458014
    Standard Packaging: 2" Waffle Pack "W" in part#.     Example: A-QFN48W.5
     
     
     
    Select the Correct Lid (Cross-Reference)
    QFN
    Series
    QFN
    Dwg Nbr
    QFN
    Description
    QFN
    Pcode
      Lid
    Series
    Lid
    Dwg Nbr
    Lid
    Description
    Lid
    Pcode
    F-QFN 4xxx52 Air Cavity XH1   F-CAP 2xxx52 Shielded
    Dome Lid
    0.6mm ID Height
    XH9
     
     
     
     
     
    Part Numbering System
    F - QFN 28 W .8 Option Version
    Air Cavity   Model Leads Packaging Pitch (mm) Substrate Cavity Type
    F = Lead Frame
    Substrate
    Singulated
      QFN = Quad
    DFN = Dual
    Number
    Pins
    W = 2" Waffle
    P = 4" Waffle
    T = JEDEC Tray
    .4
    .5
    .65
    .8
    1.0
    1.27
    2.54
    Blank =
    Cu Lead Frame
    Blank =
    Standard
    Single Die Pad

    Special 2~9
    F-QFN 0.2mm thick substrate without cavity build up. Seal with glob-top or cover with a dome lid:
    Bare 60mm Panelized Array: Change  "A" to "W".     Example: W-QFN48W.5
    Bare Singulated Substrate: Change  "A" to "S".     Example: S-QFN48W.5
     
     
     
    Drawing Numbering System
       4       5       48       5       2   
    Air Cavity
    Substrate
    Pitch Pins Pad Design Singulated or Array
    4 = QFN
    Quad Sides

    5 = DFN
    Dual Sides
    0 = None
    1 = 1.0mm
    2 = 1.27mm
    3 = 2.54mm
    4 = 0.4mm
    5 = 0.5mm
    6 = 0.65mm
    7 = Special
    8 = 0.8mm
    9 = Special
    2 ~ 99 5=Copper Lead Frame
    Single Die Pad

    2 = Singulated
     
    Packaging Codes
    Quantity
    QFN
    D/E
    Size
    W
    2" Waffle
    P
    4" Waffle
    T
    JEDEC Tray
    T
    Array
    3mm 100 306 490 256
    4mm 64 225 490 144
    5mm 36 144 490 81
    6mm 25 121 260 64
    7mm 25 81 260 49
    8mm 16 64 260 36
    9mm 16 49 260 25
    10mm 9 49 168 25
    12mm 9 36 189 16
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com


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