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F-QFN series air cavity (fully open cavity) QFN packages offer rapid prototype builds. Excellent for fabless semiconductors, RF-Microwave, and MEMS. Use for R&D, probing, laboratory projects and pre-production.
F-QFN lead frame substrates can be delivered quickly. Cover with telescoping dome lids or encapsulate by dispensing glob top over the die cavity. Great for fabless prototyping and pre-production requirements.
Features to suit your specific packaging needs:
Pads plated with NiPdAu for gold or aluminum wire-bonding.
SMT RoHS lead-free soldering.
Usable at RF Microwave.
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