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By mounting a standard IC on the top side of the board with a Mirrored Pinout IC directly under it on the other side, the size of the board shrinks, allowing smaller black boxes and lighter total systems. Copper tracing lengths dramatically reduce and performance improves. Speed increases 1 nano second faster for each 6-inch (150mm) reduction in copper etch. Cost is reduced by decreasing the number of board inner layers, with less raw materials (gold, silver, copper). |