NL Core - Mirror Semiconductor

NL Core
Under Development

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What is NL Core ? Copper Clad Laminate for BGA Substrates. Epoxy Resin - without glass fabric in the core. Better than BT, CCL-HL832, BN300 and MCL-E-679. Lower Cost. Benefits of NL Core Uniform CTE - X=Y=Z = 10ppm/°C (<T_g) Moisture absorption 3x lower than BT. Green manufacturing process. Halogen Free Thermal conductivity - Enhanced. Better X/Y registration for layer stack up. Excellent "CAF" resistance. Dust Free during punching. Environmentally Friendly - Entire manufacturing process is green. Requires no solvents. No dangerous carcinogens. Very low hydrolysable halides <1ppm. Not dependent on petrolium based chemicals. RoHS Compatible. Target Application of NL Core DRAM Substrates Excellent for DDR2 and DDR3 Halogen-Free multilayer semiconductor substrates PoP 3D and SiP (System in Package) Halogen-Free multilayer computer grade boards Dust Free punching

Uniform CTE benefit of NL Core is less stress on via hole and better stack up registration.


Typical CTE ppm/°C (<T_g)
Manufacturer	Type	X	Y	Z
Mirror Semi	NL-Core	10	10	10
Mitsubishi Gas Chemical	CCL-H832	15	15	50
Mitsui Chemicals	BN-300	12	12	54
Hitachi Chemical	MCL-E-679	12-15	14-17	50-60

Road Map of NL Core (Under development)


	Target	Sheet Size	Layer	Year
Phase 1	Pilot Line	150 x 250mm (6" x 10")	2 Layer	2008
Phase 2	Engineering Prototype Line	400 x 500mm (15.75" x 19.68")	2~4 Layer	2009
Phase 3	Volume Production License and Technology Transfer	400 x 500mm (15.75" x 19.68") and larger	2~6 Layer	2010~ 2011

Other planned development of NL Core:
Pre-preg free multi-layer stack up process.
Low moisture absorption B-Stage die-attach.
Low moisture absorption B-Stage via hold plug material.

Contact Mirror Semi for Details.

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