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Date Venue Subject Description
Oct 1, 2009 Global SMT Joe Fjelstad Bottom Terminated
Component
Apr 2, 2009 Realtime
with IPC 		Video Interview Open Cavity QFN Package
at IPC Apex Show
Mar 26, 2009 Microconnections Pacific Gate - Danny Fields Appointment Rep
in Silicon Valley
Mar 1, 2008 CircuiTree
Magazine 		Chip Packaging 2.0 Provides Benefits to Board Designers UDPo - Improving
Board Design
Feb 1, 2008 PCB Design & Fab Magazine Simultanteous IC Packaging &
PCB Co-Design Techniques		 UDPo - Improving
Board Design
Nov 14, 2007 Productronica Interview Distruptive Technology UDPo - User Definable Pinout
Productronica Show
Munich, Germany
Oct 1, 2007 Global SMT Chip Packaging 2.0 Co-design User Definable Pinouts
Aug 28, 2007 Chip Scale Review Ken Gilleo Joins Mirror Semi New member to Technical Advisory Board
Aug 1, 2007 Advanced Packaging Emerging Technology Promex selects Mirror Semi technology for assembling chips using Microbonds' insulated X-Wire.
July 11, 2007 EMS Now Joe Fjelstad Joins Mirror Semi New member to Technical Advisory Board
May 25, 2007 Global SMT & Packaging Pat Weber Joins Mirror Semi New member to Technical Advisory Board
May 2, 2007 Inside Chips Inside Chips Reviews Mirrored Pinout Origins of Mirror Semi Launch
April 27, 2007 Global SMT & Packaging Joe Fjelstad Reviews Mirrored Pinout Benefits of Mirrored Pinout SMT IC Package
April 24, 2007 Advanced Packaging Skip Fehr Joins Mirror Semi New member to Technical Advisory Board
March 7, 2007 Microbonds Microbonds Alliance on Mirrored Pinout and X-Wire Technology Microbonds and Mirror Semiconductor announce co-development project.
Jan 31, 2007 PCB007 Mirror Semiconductor Launched to Produce “Mirrored Pinout” ICs Mirrored Pinout Technology enable Faster, Smaller, Cheaper Boards.
 
 
 

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email info@MirrorSemi.com