OpenChipTM
Air Cavity Organic Packages
For Sensors and CCD Applications
 
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  • Options and features to suit your packaging needs:
  • EMC overmold covers and protects bonding wires, while exposing sensor.
  • Clear glass lid or transparent cavity fill options.
  • Single or dual air cavity option in a single package.
  • Please contact us for details
    •


    E-QFN
  • Chip carrier
  • For photodetector sensors
  • CCD applications
  • Suiteable with microlens over the pixel
  • Clear LED epoxy fill over sensor area
    		•
    Outline Top Side Bottom
     
     
    G-DFN
  • Chip carrier
  • For dual photodetector sensors
  • CCD applications
  • Suiteable with microlens over the pixel
  • Sealed glass lid
    		•
    Outline Top Side Bottom
     
      Lid Options:
    Borosilicate D263 Glass
    Polycarbonate
    Clear epoxy fill    		 Standard EMC mold compound covers and protects wire bonding, while exposing die's sensor photodetector area to an air cavity environment. Options:
    With or without
    heat spreader
     
     


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    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com

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