StackChipTM
Stackable DDR2 BGA Packages
 
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  • DDR2 StackChipTM 2Gb DDR2 Memory.


  • We assemble your 1Gb DDR2 BGA inside a stackable molded PoP package.
  • You attach another 1Gb DDR2 package on top.
  • Results in a 2Gb DDR2 memory device.
  • Same land pattern as original DDR2 device.
    •


    3D-Rotatable
    Stacked Assembly

    3D-Rotatable Bottom Interposer
    Top   Bottom View Movie Use MS ie Browser & Click Active-X
    For non-MS Browsers, Download Software
     
     
     
    Side Interposer Top Under Side
     
     
     
    Outline Drawing of Interposer:
    DDR2_256Mx4x2
    60-Ball 8x11mm
    PDF Outline Drawing #1    		 DDR2_256Mx4x2
    63-Ball 11x11.5mm
    PDF Outline Drawing #2
     
     
     
     
    How StackChip DDR2 PoP assembly is made:
    PDF Version
     
     
     


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