StackChipTM
Stackable FLASH TSOP Packages
 
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  • StackChipTM 2Gb FLASH Memory.


  • We assemble your 1Gb Flash Memory inside a stackable molded TSOP PoP package.
  • You attach another 1Gb Flash package on top.
  • Results in a 2Gb Flash memory device.
  • Same footprint as original TSOP device.
    •


    3D-Rotatable
    Stacked Assembly

    3D-Rotatable
    Bottom Interposer
    Perspective View Movie Use MS ie Browser & Click Active-X
    For non-MS Browsers, Download Software
     
     
     
    Wide Side Narrow End Under Side
     
     
     
    Outline Drawing of Interposer:
    PDF Version
     
     
     
    How StackChip TSOP PoP assembly is made:
    PDF Version
     
     
     


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    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com

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