Silicon Test Die Wire Bondable     PDF This Page   •   More Test Die:  Passivated Test Die   •   Quartz Die  •   Other Products  •   Home   Silicon Test Die Wire Bondable Patterns Silicon Die with Daisy Chain Nbr Pads Description Pad Size Size (mm) Die Material Metalization Tray Qty Part Number Fig. 8 pairs Daisy Chain 60 x 160µm 1.0 x 1.0mm Si Al 100 TD8-1.0-DC 1 16 pairs Daisy Chain 60 x 160µm 2.5 x 2.5mm Si Al 100 TD16-2.5-DC 2 24 pairs Daisy Chain 60 x 360µm 4.0 x 4.0mm Si Al 64 TD24-4.0-DC 3 Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None   Daisy Chain Patterns (Not to Scale) Fig. 1 Fig. 2 Fig. 3 TD8-1.0-DC 1.0 x 1.0mm 151008 (A2) TD16-2.5-DC 2.5 x 2.5mm 152516 (B2) TD24-4.0-DC 4.0 x 4.0mm 154024 (C3)           Silicon Die with Isolated Pads Nbr Pads Description Pad Size Size (mm) Die Material Metalization Tray Qty Part Number Fig. 16 Isolated Pad 60µm SQ. 1.0 x1.0mm Si Al 100 TD16-1.0-ISO 4 32 Isolated Pad 60µm SQ. 2.5 x 2.5mm Si Al 100 TD32-2.5-ISO 5 48 Isolated Pad 60µm SQ. 4.0 x 4.0mm Si Al 64 TD48-4.0-ISO 6 Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None   Isolated Pad Patterns (Not to Scale) Fig. 4 Fig. 5 Fig. 6 TD16-1.0-ISO 1.0 x 1.0mm 151016 (A1) TD32-2.5-ISO 2.5 x 2.5mm 152533 (B1) TD48-4.0-ISO 4.0 x 4.0mm 154048 (C1)     Silicon Die with Differential Pairs for RF/Microwave Parasitic Test Nbr Pads Description Pad Size Size (mm) Die Material Metalization Tray Qty Part Number Fig. 2 Pads With Ground Differential Pair Pad 60 x 160µm Grnd 1000µm SQ. 1.0 x1.0mm Si Al 100 TD2-1.0-DIF 7 2 Pads With Ground Differential Pair Pad 60 x 160µm Grnd 2500µm SQ. 2.5 x 2.5mm Si Al 100 TD2-2.5-DIF 8 2 Pads With Ground Differential Pair Pad 60 x 160µm Grnd 4000µm SQ. 4.0 x 4.0mm Si Al 64 TD2-4.0-DIF 9 Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None Differential Pair Pad Patterns (Not to Scale) Fig. 7 Fig. 8 Fig. 9 TD2-1.0-DIF 1.0 x 1.0mm 151002 (A4) TD2-2.5-DIF 2.5 x 2.5mm 152502 (B4) TD2-4.0-DIF 4.0 x 4.0mm 154002 (C2)       Silicon Die with Full Metallization Nbr Pads Description Pad Size Size (mm) Die Material Metalization Tray Qty Part Number Fig. 1 Large Pad Fully Metallized 1000µm SQ. 1.0 x1.0mm Si Al 100 TD1-1.0-BUS 10 1 Large Pad Fully Metallized 2500µm SQ. 2.5 x 2.5mm Si Al 100 TD1-2.5-BUS 11 1 Large Pad Fully Metallized 4000µm SQ. 4.0 x 4.0mm Si Al 64 TD1-4.0-BUS 12 Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None Fully Metallized Pad Patterns (Not to Scale) Fig. 10 Fig. 11 Fig. 12 TD1-1.0-BUS 1.0 x 1.0mm 151001 (A3) TD1-2.5-BUS 2.5 x 2.5mm 152501 (B3) TD1-4.0-BUS 4.0 x 4.0mm 154001 (C4)     JEDEC Moisture Sensitivity Level MSL-1

	More Test Die:  Passivated Test Die   •   Quartz Die  •   Flip Chip Daisy Chain  •   Other Products  •   Home
Mirror Semiconductor, Inc. 17595 Harvard Ave, Suite 509 Irvine, CA 92614, USA Toll Free USA/Canada (866) 404-8800 Email: Info@MirrorSemi.com Home