Silicon Test Die
Wire Bondable
 
 
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Silicon Test Die
Wire Bondable Patterns		 Example Die
Wire Bonded in Cavity Package
Package Selector Die Model

 
Silicon Die with Daisy Chain
Nbr
Pads		 Description Pad Size Size (mm) Die
Material		 Metalization Tray Qty Part Number Fig.
8 pairs Daisy Chain 60 x 160µm 1.0 x 1.0mm
 Si Al 100 TD8-1.0-DC 1
16 pairs Daisy Chain 60 x 160µm 2.5 x 2.5mm
 Si Al 100 TD16-2.5-DC 2
24 pairs Daisy Chain 60 x 360µm 4.0 x 4.0mm
 Si Al 64 TD24-4.0-DC 3
Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None
 
Daisy Chain Patterns
(Not to Scale)
Fig. 1 Fig. 2 Fig. 3
TD8-1.0-DC
1.0 x 1.0mm
151008 (A2)		 TD16-2.5-DC
2.5 x 2.5mm
152516 (B2)		 TD24-4.0-DC
4.0 x 4.0mm
154024 (C3)
 
 
 
 
 
Silicon Die with Isolated Pads
Nbr Pads Description Pad Size Size (mm) Die
Material		 Metalization Tray Qty Part Number Fig.
16 Isolated Pad 60µm SQ. 1.0 x1.0mm
 Si Al 100 TD16-1.0-ISO 4
32 Isolated Pad 60µm SQ. 2.5 x 2.5mm
 Si Al 100 TD32-2.5-ISO 5
48 Isolated Pad 60µm SQ. 4.0 x 4.0mm
 Si Al 64 TD48-4.0-ISO 6
Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None
 
Isolated Pad Patterns
(Not to Scale)
Fig. 4 Fig. 5 Fig. 6
TD16-1.0-ISO
1.0 x 1.0mm
151016 (A1)		 TD32-2.5-ISO
2.5 x 2.5mm
152533 (B1)		 TD48-4.0-ISO
4.0 x 4.0mm
154048 (C1)
 
 
Silicon Die with Differential Pairs for RF/Microwave Parasitic Test
Nbr Pads Description Pad Size Size (mm) Die
Material		 Metalization Tray Qty Part Number Fig.
2 Pads
With Ground		 Differential
Pair		 Pad 60 x 160µm
Grnd 1000µm SQ.		 1.0 x1.0mm
 Si Al 100 TD2-1.0-DIF 7
2 Pads
With Ground		 Differential
Pair		 Pad 60 x 160µm
Grnd 2500µm SQ.		 2.5 x 2.5mm
 Si Al 100 TD2-2.5-DIF 8
2 Pads
With Ground		 Differential
Pair		 Pad 60 x 160µm
Grnd 4000µm SQ.		 4.0 x 4.0mm
 Si Al 64 TD2-4.0-DIF 9
Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None
Differential Pair Pad Patterns
(Not to Scale)
Fig. 7 Fig. 8 Fig. 9
TD2-1.0-DIF
1.0 x 1.0mm
151002 (A3)		 TD2-2.5-DIF
2.5 x 2.5mm
152502 (B3)		 TD2-4.0-DIF
4.0 x 4.0mm
154002 (C2)
 
 
 
Silicon Die with Full Al Pattern on Top Side
Nbr Pads Description Pad Size Size (mm) Die
Material		 Metalization Tray Qty Part Number Fig.
1 Large Pad Full Pattern 1000µm SQ. 1.0 x1.0mm
 Si Al 100 TD1-1.0-BUS 10
1 Large Pad Full Pattern 2500µm SQ. 2.5 x 2.5mm
 Si Al 100 TD1-2.5-BUS 11
1 Large Pad Full Pattern 4000µm SQ. 4.0 x 4.0mm
 Si Al 64 TD1-4.0-BUS 12
Specs: Die Thickness 250µm  •  Al Metallization 1.0µm over 0.75µm SiO2  •  Passivation = None
Full Pad Patterns
(Not to Scale)
Fig. 10 Fig. 11 Fig. 12
TD1-1.0-BUS
1.0 x 1.0mm
151001 (A4)		 TD1-2.5-BUS
2.5 x 2.5mm
152501 (B4)		 TD1-4.0-BUS
4.0 x 4.0mm
154001 (C4)
 
 
JEDEC Moisture Sensitivity Level MSL-1
 
Package Selector
Test Die Part Numbering System
TD16 - 2.5 - DC  
Test Die I/O   Die Size (mm)   Patterns Options
1=Fully Plated
2=Differential Pair
3~99=I/O Pads		   1.0=1.0x1.0mm
2.5=2.5x2.5mm
4.0=4.0x4.0mm
Other sizes available		   Pattern Code:
DC
BUS
ISO
DIF

Wire Bond Code:
DCW		 Blank=Standard 250um Thick
BG##=Special Backgrinding
E = Eutectic Solder Version
Attach standard die with die attach adhesive.
 
 
Die Daisy Chain Numbering System
   25       16       0   
Die Size Code I/O Pattern Variation
10 = 1.0x1.0mm

25 = 2.5x2.5mm

40 = 4.0x4.0mm

Other Sizes Available		 00 = Fully Plated Al Top Side

08 = 8 pads
16 = 16 pads
24 = 24 pads
48 = 48 pads
99 = 100 pads		 0 = Bare Die

Daisy Chain Wire Bond Patterns
(DCW - Packaged inside QFN)
1 = Standard
2~8 = Variations
9 = Bus (All Pins Connected)
 
 
 
        
 
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