Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•For engineering and rapid prototypes.
•Complies to JEDEC Standard MO-220 VQFN
Lids Flat and dome covers.
Sockets Window for probing into cavity.
Engineering Kit Packages and lids for evalution.
CAD DXF and PDF drawings center.
Material Properties Df , Dk, ε , δ