Management: Martin Hart Curtis Campbell , CFO of Mirror Semiconductor, and managing member of TopLine Partners LLC, is senior tax partner of an Orange County, California CPA accountancy firm. Curtis graduated with a Bachelor of Science Degree in Accounting from California State University, Long Beach as well as receiving a Master of Science Degree in Taxation from Golden Gate University. Ron Iscoff , Marcom Manager. Wealth of experience in marketing and public relations in Silicon Valley. Was editor of industry publications including Semiconductor International and Electronic Packaging and Production. Graduate of California State University, Long Beach with Bachelor of Arts Degree in Journalism. Subu Sankar , Director of IT. 20 years experience with software architecture and web based solutions. Past 5 years as Director of IT at TopLine Corporation. Participated in Silicon Valley start-ups as well as managing dual shore teams. Degree in Electronics Engineering from a University in India. S.K. Kang , General Manager Korean Branch Office. Founded Standard Systems, a provider of IC assembly services to fabless semiconductor companies. Previously was senior test process engineer at Motorola Korea and applications manager at Micro Component Technology, a semiconductor equipment maker. Technical Advisory Board: Bert Haskell has over 20 years of diversified technology experience and a strong background in electronic packaging technologies. His accomplishments include managing the marketing and development of two ground breaking Tablet PC products at Motion Computing, developing marketing and alliance strategies for the AMD Athlon 64 Mobile processor, creating and managing the MCC Portable Electronics Research program, serving as a founder and board member of Portelligent, Inc., launching a flat-panel display start-up, and launching a wireless internet start-up. He has published numerous technical articles and research reports related to electronic packaging technologies and is the author of the book titled "Portable Electronic Product Design and Development" (McGraw-Hill 2004).Pankaj Gulati is a seasoned executive with over 25 years experience running an international manufacturer of semiconductors. He holds Master Degrees in Physics from University of Delhi. He is Executive Vice President and C.O.O. of Continental Device India Limited (CDIL), a large semiconductor company.Dr. Gerald "Skip" Fehr has a long history of participation in the semiconductor industry. Prior to co-founding semiconductor packaging foundry IPAC (now i2a Technologies) in Silicon Valley, California, Skip spent many years as a director at chipmaker LSI Logic. Previously, Skip wore employee badge number 32 at Intel. Earlier, he held technical posts at other leading semiconductor companies, including Burroughs, Fairchild Semiconductor and Texas Instruments. Dr. Fehr received a Ph.D. in Ceramic Engineering from Iowa State University. Full Bio.Patrick Weber has 3 decades of experience in the semiconductor industry. He holds 19 patents involving semiconductor design and packaging. Patrick has been CTO and President of Hestia Technologies, offering creative solutions in semiconductor packaging since 1983. Previously, he held engineering responsibilities at Honeywell Synertek and National Semiconductor. Patrick holds a Bachelor of Science in Mechanical Engineering degree from the University of Wisconsin.Naeem Zafar is a serial entrepreneur and devoted to mentorship. Based in Silicon Valley, California, he is currently a partner with Concordia Ventures, a company that advises and invests in entrepreneurs and startups. Previously, Naeem was president and CEO of three companies involved in semiconductor and EDA (Electronic Design Automation) software. He led Pyxis Technology, Silicon Design Systems and Veridicom Inc, a Lucent/Bell Labs spin-off, where he built teams and raised venture capital. Naeem has been a frequent lecturer on entrepreneurship and high-tech startups. He has lectured or co-taught entrepreneurship at UC Berkeley, Columbia University, UCLA and Brown University. Naeem holds a Bachelor of Science degree in Electrical Engineering from Brown University (magna cum laude) and a Master's degree in Electrical Engineering from University of Minnesota.Joseph Fjelstad is a 34-year veteran of electronics interconnection industry with a background in chemistry and chemical processing as applied to electronics manufacture. He is CEO of startup Verdant Electronics as well as co-founder and CEO of SiliconPipe. He was appointed the first fellow at IC packaging pioneer Tessera Technologies for his many inventions. Fjelstad is holder of 120 issued US patents along with many other foreign patents and has nearly 100 other patents pending in areas ranging from electronics and medical products to eyeware and toys. Co-inventor of AnyChipTM, Fjelstad is also author or co-author of numerous articles, papers, magazine columns and engineering books including Chip Scale Packaging for Modern Electronics and Flexible Circuit Technology.Dr. Ken Gilleo has 35 years experience with electronic packaging companies, including 3M, Allied Signal, Cookson Electronics, Poly Flex Circuits and Tessera. Currently CEO of ET-Trends LLC, a consulting firm focused on emerging technologies. Extensive experience in printed circuits and polymer thick-film electronics. Inventor with more than 33 U.S. patents. Serves as expert witness for patent litigation. Holds a Ph.D. in chemistry from the University of Connecticut. His most recent book MEMS/MOEMS Packaging ,published by McGraw-Hill.Charles S. Clark Liberty University, Lynchburg, Virginia, was recently endowed with the Technology, Patent (Pending). Dr. Barry N. Moore is LU Vice President for University Relations and Jerry Falwell Jr. is Vice-Chancellor.
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