Open Cavity
Air Cavity QFN
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Soft-tooled construction with semiconductor grade substrate and build-up epoxy encapsulated dam to create the open die cavity.

  • Options to suit your specific packaging needs:
  • Singulated version for one-off prototype.
  • Panelized array for step-and-repeat assembly.
  • Array options: Wafer saw/dice or snap-apart by hand using X-Acto blade to singulate.
  • 50 µ-inch (1.3 µm) thick wire-bondable soft gold plating in die cavity.
  • 31 standard JEDEC outlines.
  • Quick-tooled, custom outlines available.
    		•


    A-QFN Series
  • Singulated device
  • Quickly package your own die
  • 2" Waffle Pack
    		•
    Top View
    Singulated
    Open Cavity
    Bottom View
    SMT PC Board
    Solder Side
    Top View
    Die Cavity
    After Wire Bonding
     
     
    AH-QFN Series
  • Panelized array
  • Pre-sawn
  • Singulate by hand
  • Cut with X-Acto knife
    or use razor blade
    		•
    Top View
    Partially Sawn
    Open Cavity Array
    Use X-Acto knife
    or use razor blade
    to singulate by hand.
    Top Detail
    Partially Sawn
    Open Cavity Array
     
     
    AW-QFN Series
  • Panelized array
  • Fiducials for sawing
  • Use 12mil (0.3mm) blade
        to saw/singulate
    		•
    Top View
    Open Cavity Array
    Top View
    Detail of
    Fiducials for Sawing
    Bottom View
    Detail of SMT Mounting
     
     
    W-QFN Series
  • Bare substrate array
  • Without cavity Build up
  • Fiducials for sawing
  • Use 12mil (0.3mm) blade
        to saw/singulate
    		•
    Top View
    Substrate Array
    Bottom View
    Substrate Array
    Detail of Die Pad
    & Bonding Fingers
     
     
    S-QFN Series
  • Singulated substrate
  • Without cavity build up
  • Packed in 2" waffle tray
  • Ready to wirebond
  • Encapsulate with glob-top
    		•
    Top View
    Singulated Substrate
    Bottom View
    Singulated Substrate
    After Wire Bonding
    3D view     2D View
     
    Air Cavity Catalog

    Sample Display Box
     


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    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com