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Products IC Package Solutions |
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MirrorSemiTM offers unique semiconductor packaging solutions for: •Memory stacking •Stackable MEMS packaging •Mirrored Pinouts •UDPo - User Definable Pinouts •Retrofit adaptors for legacy and sunset devices |
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| OpenChipTM Air Cavity Stackable QFN 3 in 1 Features: Stackable, Mirrorable, Testable. For silicon die or MEMS. Seal with B-stage lid. |
FLASH StackChipTM TSOP Stackable PoP Converts Two TSOP FLASH Into 2Gb Memory device. |
DDR2 StackChipTM BGA PoP Interposers Converts Two DDR2 Into 2Gb Memory device. |
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AnyChipTM IC Interposers Adapt Legacy and Sunset chips To Fit Your Board |
| UDPo User Definable Pinout Optimize PC Board Design |
MirrorChipTM Mirrored Pinouts For Improved Board Design |
Mirror Semiconductor
17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
Tel: 1-866-404-8800 • Fax: 1-714-242-1770
email to Info@MirrorSemi.com
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