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Packaging solutions for:
Air & Open Cavity   •   Silicon Prototype   •  Sensors   •   RF   •   MEMS


Open Cavity pre-molded air cavity QFN. Ready for die and wire bonding Daisy Chain Si Test Die for characterization and wire bonding practice Molded dome lids
OpenChipTM
Open (air) Cavity QFN
 For silicon, MEMS, RF, and sensors
Ready for die attach and wire bonding.
Excellent for prototype and pre-production		 Daisy Chain Die
Silicon Test Die
For characterization
Bonding practice
Enviromental Use		 Dome Lid
Die Cover
Seals die and wire bonding
 
 
 
Engineering evaluation kits include assortment of open cavity QFN packages and lids Flat Lids Rogers RO4003C and other materials. Colors available
Socket
Window allows probing
inside die cavity under test.		 Engineering Evaluation Kits
Assortment of Open Air Cavity packages and lids		 Flat Lid
Variety of flat lids
to cover cavity packages
 
 
 
 
 
 


Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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