PST Series - Thermal Test Die with Resistive Heaters |
Nbr Pads |
Features |
Pitch |
Die Size (mm) |
Die Thickness |
Waffle Tray Qty |
5" Wafer (125mm) Die Qty |
Bondable Pad |
Single Die Part Number |
Unsawn Wafer Part Number |
Photo |
Schematic |
32 |
Heating Elements 2x Resistive Heaters
Temperature Sense Kelvin-Diode-Resistor 5x Serial Diode Sensor |
X=230µm Y=230µm |
2.5mm 100 mil |
100~635µm 4~25 mil |
100 Die 2" Tray |
1600 Die 5" Wafer |
ø102µm 4.0 mil |
PST1-G2.5A |
PSTW1-G2.5A |
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□122µm 4.8 mil |
PST1-B2.5A |
PSTW1-B2.5A |
21 |
Heating Elements 2x Resistive Heaters
Temperature Sense 5x Serial Diode Sensor |
X=460µm Y=690µm |
3.81mm 150 mil |
100~635µm 4~25 mil |
64 Die 2" Tray |
700 Die 5" Wafer |
ø100µm 4.0 mil |
PST2-G3.8A |
PSTW2-G3.8A |
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|
Ø127µm 5.5 mil |
PST2-N3.8A |
PSTW2-N3.8A |
□150µm 5.9 mil |
PST2-C3.8A |
PSTW2-C3.8A |
76 |
Heating Elements 2x Resistive Heaters
Temperature Sense Kelvin-Diode-Resistor 5x Serial Diode Sensor |
X=231µm Y=231µm |
5.08mm 200 mil |
100~635µm 4~25 mil |
36 Die 2" Tray |
340 Die 5" Wafer |
□120µm 4.7 mil |
PST3-B5A |
PSTW3-B5A |
|
|
48 |
Heating Elements 2x Resistive Heaters
Temperature Sense Kelvin-Diode-Resistor 5x Serial Diode Sensor Center & each corner |
X=381µm Y=508µm |
6.35mm 250 mil |
100~635µm 4~25 mil |
25 Die 2" Tray |
236 Die 5" Wafer |
Ø100µm 4.0 mil |
PST4-G6.3A |
PSTW4-G6.3A |
|
|
60 |
Heating Elements 2x Resistive Heaters
Temperature Sense Kelvin-Diode-Resistor 5x Serial Diode Sensor Center & each corner |
X=381µm Y=508µm |
7.8mm 306 mil |
100~635µm 4~25 mil |
64 Die 4" Tray |
146 Die 5" Wafer |
Ø182µm 7.2 mil |
PST5-U7.8A |
PSTW5-U7.8A |
|
|
82 |
Heating Elements 2x Resistive Heaters
Temperature Sense Kelvin-Diode-Resistor 5x Serial Diode Sensor Center & each corner |
X=381µm Y=508µm |
10mm 400 mil |
100~635µm 4~25 mil |
49 Die 4" Tray |
80 Die 5" Wafer |
□183µm 7.2 mil |
PST6-D10A |
PSTW6-D10A |
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Note 1: Standard Die thickness 635um (25MIL) |
Note 2: Thinning available: 500um (20MIL), 430um (17MIL), 360um (14MIL), 250um (10MIL), 200um (8MIL), 150um (6MIL), 100um (4MIL) |
Note 3: JEDEC Moisture Sensitivity Level MSL-1. |
Note 4: Applications: Use PST series test die to heat semicoductor packages and measure changes in temperatures, ΘJC and ΘJA. A four pad layout allows Kelvin connections. A temperature monitoring circuit uses a bridge network. Chips include serial five-diode temperature sense network. Power up to 2.5W per die. |
Note 5: Stack Die: Multiple die can be thinned to 127um (5mils) and stacked in offset pryamid fashion for easy wire bonding. Use 0.0381mm thick non-conductive die attach material between PST-2 to PST-4 and PST-4 to PST-6. Use electrically conductive die attach material between PST-6 and the substrate. |
Note 6: Resistive Heaters: All die have dual resistive heaters connection Rs to Rf. Typically powered 0 to 3.5V at 160mA (0.5W) |
Note 7: Temperature Sense Network: All PST series die have serial five-diodes to sense temperature. |
Note 8: Meets JEDEC specification EIA/JESD51-4. |
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