Open cavity (air cavity) semiconductor packages for fabless, prototype, probing, pre-production, silicon, MEMS and RF-Microwave applications. Use for R&D, laboratory projects and pre-production.
Part Numbering System Package
M
-
QFN
16
W
.5
- G6
Cavity Type
Model
Leads
Packaging
Pitch (mm)
Option
Cavity Package: M = Molded/Plastic Cu Leadframe (C-194 F/H)
QFN = Quad DFN = Dual
Number Pins
Standard:
W = 2" Waffle
T = 4" Waffle
Optional:
J = JEDEC Tray
M = Tube
E = T&R
.4 .5 .65 .8
M-QFN Series: G5 = Fully Plated Die Pad NiPdAu (Thick Gold)