 |
 |
Open Cavity
Air Cavity QFN Packages
RF, MEMS & Semiconductor |
 |
| |
 More Products
Lids
Sockets
Evaluation Kits
Chip Carriers
Assembly
Contact
Home
|
| |
M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.
Singulated, ready for die attach and wire-bond.
Cover with lid or fill with glob-top.
Features to suit your specific packaging needs:
CAD Drawings Center: DWG, DXF, SAT, IGES, STEP , EASM, EPRT, PDF
Customer Design Questionnaire .
Lid and Cap System Lids.
Material Properties: CTE, Dk , Df, ε , δ
Plating: Thickness (G3=NiAu, G4=NiPdAu, G5=NiPdAu, G6=NiPdAu and G7=NiPdAu)
Wire Bonding Temperature: 180°C Max • Peak Reflow Temp: 260°C Max
MSL-3 (Moisture Sensitivity Level)
Die Attach Adhesive: Conductive or Non-Conductive.
Eutetic Die Attach AuSn, AuSi
Wire Bonding Photo Gallery
Package Part Numbering System
EAR99 • HS 8542.90.0000 • RoHS Pb-Free • JEDEC MO-220 VQFN
|
Check our 3D
Solidworks Models |
| |
| |
| |
| Examples of Open Cavity M-QFN |
8L 3x3mm
Pitch 0.65mm |
12L 3x3mm
Pitch 0.5mm |
16L 3x3mm
Pitch 0.5mm |
16L 4x4mm
Pitch 0.65mm |
20L 4x4mm
Pitch 0.5mm |
24L 4x4mm
Pitch 0.5mm |
32L 5x5mm
Pitch 0.5mm |
40L 5x5mm
Pitch 0.4mm |
40L 6x6mm
Pitch 0.5mm |
48L 6x6mm
Pitch 0.4mm |
48L 7x7mm
Pitch 0.5mm |
56L 8x8mm
Pitch 0.5mm |
64L 9x9mm
Pitch 0.5mm |
72L 10x10mm
Pitch 0.5mm |
80L 12x12mm
Pitch 0.5mm |
3L • 8L • 14L
16L • 16L WIDE
20L • 24L • 28L |
| M-TO220 Open (Air) Cavity Power Packages |
N
Leads |
P
Pitch |
D/E
Body |
D1/E2
Die Pad |
Plating
Spec |
Qty
Tube |
Part Number |
Outline
Drawing
PDF |
Status |
| 3 |
2.54mm |
10x9mm |
8.6x4.5mm |
G3 |
50 |
M-TO220-G3 |
122203 |
G3 Tooled |
|
 Install Solidworks e-Drawings software Version 10.
Required to view rotatable models:
PC Version • Mac Version |
|
| |
| |
|
Package Part Numbering System |
| M |
- |
QFN |
16 |
W |
.5 |
- G3 |
| Cavity Type |
|
Model |
Leads |
Packaging |
Pitch (mm) |
Option |
Cavity Package:
M = Molded/Plastic
Cu Leadframe (C-194F/H)
Under Development:
A = BT HL832NS
R = Rogers RO-4003C
AW = BT HL832NS Arrays
RW = Rogers RO-4003C Arrays
|
|
QFN = Quad
DFN = Dual
SO = Small Outline |
Number
Pins |
W = 2" Tray
T = 4" Tray
M = Tube
|
.4
.5
.65
.8
1.27 |
M-QFN:
G3 = NiAu (Thick Gold)
G4 = NiPdAu (Thick Gold)
G5 = NiPdAu (Medium Gold)
G6 = NiPdAu (Very Thin Gold)
G7 = NiPdAu (Thin Gold)
C-QFN:
G1 = NiPdAu
G2 = NiAu
Under Development:
A-QFN and R-QFN:
G2 = NiPdAu
G3 = NiAu
|
|
| Click Lid part numbering system. |
| |
| |
|
Drawing Numbering System |
| 4 |
5 |
16 |
5 |
0 |
Open Cavity
Package |
Pitch |
Pins |
Plating & Construction |
Packaging |
4 = QFN
Quad Sides
5 = DFN
Dual Sides
1 = SOIC
Gull Wing |
Standard:
4 = 0.4mm
5 = 0.5mm
6 = 0.65mm
8 = 0.8mm
2 = 1.27mm
Special:
0 = None
1 = 1.0mm
3 = 2.54mm
7 = Special
9 = Special |
08 = 8L
10 = 10L
12 = 12L
14 = 14L
16 = 16L
20 = 20L
24 = 24L
28 = 28L
32 = 32L
36 = 36L
40 = 40L
44 = 44L
48 = 48L
52 = 52L
56 = 56L
64 = 64L
72 = 72L
80 = 80L
99 = 100L
|
Ceramic Package:
1=NiPdAu (Ceramic Package)
"M" - Cu Lead Frame:
3=NiAu (Thick Gold)
5=NiPdAu (Medium Gold)
6=NiPdAu (Very Thin Gold)
7=NiPdAu (Thin Gold)
Under Development:
A-QFN BT-HL832NS:
2 = NiAu
4 = NiPdAu
R-QFN Rogers RO-4003C:
8 = NiAu
9 = NiPdAu
|
Single Units:
0 = 2" Waffle Tray (W)
4 = 4" Waffle Tray (T)
3 = Tube (M)
9 = JEDEC Tray (J)
Arrays Under Development:
AW-QFN and RW-QFN:
6 = Unsawn ARRAY
|
| |
|
Packaging Codes
Quantity |
QFN
D/E
Size |
W
2" Waffle
Tray |
T
4" Waffle
Tray |
J
JEDEC
Matrix Tray |
| 3mm |
100 |
256 |
490 |
| 4mm |
64 |
196 |
490 |
| 5mm |
36 |
144 |
490 |
| 6mm |
25 |
121 |
260 |
| 7mm |
25 |
81 |
260 |
| 8mm |
16 |
64 |
260 |
| 9mm |
16 |
49 |
260 |
| 10mm |
9 |
49 |
168 |
| 12mm |
9 |
36 |
189 |
|
| |
|
|
