M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Singulated, ready for die attach and wire-bond. Cover with lid or fill with glob-top.
Features to suit your specific packaging needs:
CAD Drawings Center: DWG, DXF, SAT, IGES, STEP , EASM, EPRT, PDF
Customer Design Questionnaire .
Lid and Cap System Lids.
Material Properties: CTE, Dk , Df, ε , δ
Plating: Thickness (G3=NiAu, G4=NiPdAu, G5=NiPdAu, G6=NiPdAu and G7=NiPdAu)
Wire Bonding Temperature: 180°C Max • Peak Reflow Temp: 260°C Max
MSL-3 (Moisture Sensitivity Level)
Die Attach Adhesive: Conductive or Non-Conductive.
Eutetic Die Attach AuSn, AuSi
Wire Bonding Photo Gallery
Package Part Numbering System
EAR99 • HS 8542.90.0000 • RoHS Pb-Free • JEDEC MO-220 VQFN
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