M-SO8M-G3 Open Cavity SOIC Wire Bond your die in SOIC Package Mirror Semiconductor - 120108 , 110008 , M-SO8M1.27-G3 , M-SO8M1.27-G3-BARE , M-SO8M1.27-BARE

M-SO8M1.27
Open Cavity 8L-SOIC

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M-QFN Open cavity (air cavity) packages for quick-to-market applications. Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required. Features to suit your specific packaging needs: See our Lids. See All Open Cavity Packages Available

M-SO8M1.27 Open (Air) Cavity 8L SOIC
N Leads	P Pitch	D/E Body	D1/E2 Die Pad	Plating Spec	Tube Qty	Part Number	PDF Outline Drawing	Status
8	1.27mm	3.9x4.95mm	2.5X1.9mm	G3	25	M-SO8M1.27-G3 Ni-Au Gold Die Pad Standard	120108	Tooled
8	1.27mm	3.9x4.95mm	2.5X1.9mm	G3	25	M-SO8M1.27-G3-BARE Plastic Die Pad Special	110008	Tooled

Drawings • CAD Documents Click link to Download File
Standard M-SO8M1.27-G3	Special M-SO8M1.27-BARE-G3	Solidworks easm Model M-SO8M1.27-G3 Standard	Solidworks easm Model M-SO8M1.27-BARE-G3 Special

Install Solidworks e-Drawings software. Required to view rotatable models: Download

STANDARD
M-SO8M1.27-G3
GOLD DIE PAD
8L SOIC
Pitch 1.27mm

SPECIAL
M-SO8M1.27-G3-BARE
BARE DIE PAD
8L SOIC
Pitch 1.27mm

Bottom View
8L SOIC
Pitch 1.27mm


Construction: Copper Lead Frame (A-194 F/H) G3 - Ni 2.5 ~ 7.9µm • Au 1.27µm Molding Compound: Semiconductor Grade

Cavity Package Part Numbering System
M	-	SO	8	M	1.27	- G3
Cavity Package		Model	Leads	Packaging	Pitch (mm)	Plating
M = Molded Plastic Cu Leadframe (A-194F/H)		SOIC Small Outline Package	8L 3.9x4.95mm	Standard: M = Tube	1.27mm	G3 NiAu Plating

Flat Lids • Flat Covers
Part Series	C-LID-SO8-BLACK
Shape	Flat
Material	Ceramic
Color	Black
D/E Size	3.73x4.7mm
Thickness	0.381mm
Attach	Permanent
Sealing Method	LCA3000X B-Stage Preform
Top View
Bottom View
Rotatable Model	C-LID-SO8-BLACK
Install Solidworks e-Drawings software. Required to view rotatable models: PC Version • Mac Version

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