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Flat lids for cavity package. Dome lid for flat substrate package. Excellent for fabless prototype, probing, RF-Microwave and MEMS. Recommended for R&D, laboratory projects and pre-production.
Option 1: Flat lids cover open cavity QFN packages. Option 2: Dome lids (caps) cover flat QFN substrates.
Lid and Cap system to suit your specific package needs:
Available singulated or panelized array.
Attach with variety of epoxy glue materials
Standard lid.
Low loss microwave Rogers RO4003C lids optionally available.
Selecting Open Cavity QFN Check List.
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