Products
IC Package Solutions
 
 
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Packaging solutions for:
Air & Open Cavity   •   Silicon Prototype   •  Sensors   •   RF   •   MEMS


Open Cavity pre-molded air cavity QFN.  Ready for die and wire bonding Flat Lids Rogers RO4003C and other materials. Colors available Molded dome lids
OpenChipTM
Open (air) Cavity QFN
 For silicon, MEMS, RF, and sensors
Ready for die attach and wire bonding.
Excellent for prototype and pre-production
Flat Lid
Variety of flat lids
to cover cavity packages
Dome Lid
Die Cover
For Tall Die
 
 
 
Engineering evaluation kits include assortment of open cavity QFN packages and lids Engineering evaluation kits include assortment of open cavity QFN packages and lids
Socket
Window allows probing
inside die cavity under test.
Engineering Evaluation Kits
Assortment of Open Air Cavity packages and lids
Bonding Wire
Made by Tanaka
 
 
 

Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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