Open Cavity Semiconductor Packaging

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MirrorSemi^TM offers unique semiconductor packaging solutions for: •Air & Open Cavity •Sensors •RF •Stacking •MEMS •*PiP* package in package modules for chip correction


OpenChip^TM Air Cavity QFN For silicon, MEMS, RF, and sensors Excellent for prototype and pre-production	FLASH StackChip^TM TSOP Stackable PiP Package stack TSOP FLASH	DDR2 StackChip^TM BGA PiP Interposers Package stack DDR2



		AnyChip^TM *PiP* Package in Package. Obsolescence Solutions Corrects mistakes. Replacement for sunset chips. Fits to original footprint.
UDPo User Definable Pinout Optimize PC Board Design	MirrorChip^TM Mirrored Pinouts For Improved Board Design