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Packaging solutions for:
Air & Open Cavity   •   Silicon Prototype   •  Sensors   •   RF   •   MEMS


Open Cavity pre-molded air cavity QFN. Ready for die and wire bonding Daisy Chain Si Test Die for characterization and wire bonding practice Molded dome lids
OpenChipTM
Air Open Cavity QFN
 For silicon, MEMS, RF, and sensors
Ready for die attach and wire bonding.
Excellent for prototype and pre-production		 Daisy Chain
Silicon Test Die
For characterization & bonding practice		 Dome Lid
Die Cover
Use to seal die and wire bonding
 
 
 
 
 
 
 


Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email to Info@MirrorSemi.com

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