Part Numbering System
Open (Air) Cavity QFN Packages
 
 
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Open cavity (air cavity) semiconductor packages for fabless, prototype, probing, pre-production, silicon, MEMS and RF-Microwave applications. Use for R&D, laboratory projects and pre-production.
 
Part Numbering System
Package
M - QFN 16 W .5 - G6
Cavity Type   Model Leads Packaging Pitch (mm) Option
Cavity Package:
M = Molded/Plastic
Cu Leadframe (C-194 F/H)
Use Flat Lid


Substrate Package:
S = Flat Cavity
Ceramic RO4003C
Use Dome Lid		   QFN = Quad
DFN = Dual		 Number
Pins		 Standard:
W = 2" Waffle

Optional:
P = 4" Waffle
T = JEDEC Tray
M = Tube
E = T&R		 .4
.5
.65
.8		 M-QFN Series:
G5 = Fully Plated Die Pad
NiPdAu (Thick Gold)

G6 = Fully Plated Die Pad
NiPdAu (Thin Gold)

AE=Adhesion Enhanced
Ring Plated Die Pad
NiPdAu (Thin Gold)

S-QFN Series:
R = RO4003 - Ceramic
Plating NiAu
Click Lid part numbering system.
 
 
Drawing Numbering System
Package
   4       5       16       5       0   
Open Cavity
Package		 Pitch Pins Plating & Construction Packaging
4 = QFN
Quad Sides

5 = DFN
Dual Sides		 0 = None
1 = 1.0mm
2 = 1.27mm
3 = 2.54mm
4 = 0.4mm
5 = 0.5mm
6 = 0.65mm
7 = Special
8 = 0.8mm
9 = Special		 2 ~ 99 Cu Lead Frame:
5=Fully Plated Die Pad
NiPdAu (Thick Gold)

6=Fully Plated Die Pad
NiPdAu (Thin Gold)

7=Ring Plated AE Die Pad
NiPdAu  (Thin Gold)





Special Versions:
0~3 = Customer Specific 		M-QFN:
0 = 2" Waffle Tray (W)
4 = 4" Waffle Tray (P)
9 = JEDEC Tray (T)
 
Packaging Codes
Quantity
QFN
D/E
Size		 W
2" Waffle
Tray		 P
4" Waffle
Tray		 T
JEDEC
Tray		 A
MA-QFN
Unsawn Array
Under Development
3mm 100 306 490 289
4mm 64 225 490 169
5mm 36 144 490 121
6mm 25 121 260 100
7mm 25 81 260 64
8mm 16 64 260 64
9mm 16 49 260 49
10mm 9 49 168 36
12mm 9 36 189 25
 
 

Mirror Semiconductor
17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
Tel: 1-866-404-8800 • Fax: 1-714-242-1770
email to Info@MirrorSemi.com


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