Part Numbering System
Open (Air) Cavity QFN Packages
 
 
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Open cavity (air cavity) semiconductor packages for fabless, prototype, probing, pre-production, silicon, MEMS and RF-Microwave applications. Use for R&D, laboratory projects and pre-production.
 
Part Numbering System
Package & Substrate
M - QFN 28 W .8 Option Version
Cavity Type   Model Leads Packaging Pitch (mm) Substrate Material Customized
Cavity Wall:
M = Singulated (Sawn)
MA = Unsawn Array

Flat Substrate:
F = Singulated Sawn
FA = Unsawn Array
S = Singulated RO-4003		   QFN = Quad
DFN = Dual		 Number
Pins		 Standard:
W = 2" Waffle

Optional:
P = 4" Waffle
T = JEDEC Tray
E = T&R		 .4
.5
.65
.8
1.0
1.27
2.54		 M-QFN, F-QFN Series:
Cu (C-194 F/H)
Leadframe = Blank

S-QFN Series:
R = RO-4003C		 Standard = Blank

Special 2~9
Click Lid part numbering system.
 
 
Drawing Numbering System
Package and Substrate
   4       5       48       1       0   
Open Cavity
Package		 Pitch Pins Pad Design Singulated or Array
4 = QFN
Quad Sides

5 = DFN
Dual Sides		 0 = None
1 = 1.0mm
2 = 1.27mm
3 = 2.54mm
4 = 0.4mm
5 = 0.5mm
6 = 0.65mm
7 = Special
8 = 0.8mm
9 = Special		 2 ~ 99 Standard:
5=Cu Leadframe

RF - Microwave:
4=Rogers RO4003C
6=Ceramic LTCC



Special Versions:
0=Bare Cavity Floor
1=BT - Single Die Pad
2=Two Die Pads
3=Multiple Die Pads
 Singulated (Sawn):
0 = M-QFN
2 = S-QFN

Array (Unsawn):
1 = FA-QFN Cu L/F
1 = W-QFN Rogers
6 = MA-QFN Cu L/F
 
Packaging Codes
Quantity
QFN
D/E
Size		 W
2" Waffle		 P
4" Waffle		 T
JEDEC Tray		 P
MA-QFN
FA-QFN
66mm Unsawn Array
3mm 100 306 490 289
4mm 64 225 490 169
5mm 36 144 490 121
6mm 25 121 260 100
7mm 25 81 260 64
8mm 16 64 260 64
9mm 16 49 260 49
10mm 9 49 168 36
12mm 9 36 189 25
 
 

Mirror Semiconductor
17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
Tel: 1-866-404-8800 • Fax: 1-714-242-1770
email to Info@MirrorSemi.com


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