Mirror Semiconductor M-QFN Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN... . . . . M-QFN8W.65-G5 , M-QFN12W.5-G6 , M-QFN12W.65-G6 , M-QFN12W.8-G6 , M-QFN16W.5-AE , M-QFN16W.5-G6 , M-QFN16W.65-G5 , M-QFN16W.8-G6 , M-QFN20W.4-G6 , M-QFN20W.5-G5 , M-QFN20W.65-G6 , M-QFN20W.8-G6 , M-QFN24W.5-G6 , M-QFN24W.65-G6 , M-QFN24W.8-G6 , M-QFN28W.4-G3 , M-QFN28W.4-G6 , M-QFN28W.5-G6 , M-QFN28W.65-G6 , M-QFN28W.8-G6 , M-QFN32W.5-AE , M-QFN32W.5-G6 , M-QFN32W.65-G6 , M-QFN32W.8-G6 , M-QFN36W.4-G6 , M-QFN36W.5-G6 , M-QFN40W.4-G5 , M-QFN40W.5-G6 , M-QFN40W.65-G6 , M-QFN44W.5-G6 , M-QFN44W.65-G6 , M-QFN48W.4-G5 , M-QFN48W.5-AE , M-QFN48W.5-G6 , M-QFN52W.5-G6 , M-QFN56W.4-G6 , M-QFN56W.5-G5 , M-QFN64W.4-G6 , M-QFN64W.5-G5 , M-QFN68W.4-G6 , M-QFN68W.5-G6 , M-QFN72W.4-G6 , M-QFN72W.5-G5 , M-QFN76W.4-G6 , M-QFN80W.5-G5 , M-QFN88W.4-G3 , M-QFN88W.4-G6 , M-QFN100W.4-G3 , M-QFN100W.4-G6 . . . . 460850 , 451260 , 451660 , 451670 , 461650 , 452050 , 452460 , 453260 , 453270 , 444050 , 454060 , 444850 , 454860 , 454870 , 455650 , 456450 , 457250 , 458050 , 461260 , 481260 , 481660 , 442060 , 462060 , 482060 , 462460 , 482460 , 442860 , 442830 , 452860 , 462860 , 482860 , 463260 , 483260 , 443660 , 453660 , 464060 , 454460 , 464460 , 455260 , 445660 , 446460 , 446860 , 456860 , 447260 , 447660 , 448860 , 448830 , 449960 , 449930 . . . . Footprints match OmPP and OCPP and Open-Pak OCP , DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B , Microelectronic semiconductor assembly, pkg parts, packaging, packages, . . . IC assembly, assemblies, assembly packaging and test Ball bonding, Wire bonding , microelectronics , wedge bonding. Die bonding , die bond process, die bonder machine. Chip scale package, RF IC design , RFIC design. MEMSic , MEMS Package Packaging , semiconductors , foundry services, foundries , wafers , Wafer dicing , chip carrier package, chip die ,

Open Cavity QFN
Chip Package Solutions

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Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding

M-QFN Series

Open Tooled Packages
8L 3x3mm • 12L 3x3mm
16L 3x3mm • 16L 4x4mm
20L 4x4mm • 24L 4x4mm
32L 5x5mm • 40L 5x5mm
40L 6x6mm • 48L 6x6mm
48L 7x7mm • 56L 8x8mm
64L 9x9mm • 72L 10x10mm
80L 12x12mm • 100L 12x12mm

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Quick lab prototypes and pre-production.

Lids Flat and dome covers.

Sockets Window for probing into cavity.

Engineering Kit Packages and lids for evalution.

CAD DXF and PDF drawings center.

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Oct 5-6, 2011 IWLPC - Santa Clara, California
Nov 15-18, 2011 Productronica - Munich Germany
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