Open Cavity QFN Packages
All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka
End of Life Notice
Open cavity M-QFN Series suffix G5, G6 and G7 are scheduled for obsolescence.
Not recommended for new designs. Packages will be available until finished goods inventory is depleted.
Please inquire about replacement package with suffix G3 NiAu plating.
Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN
Lids Flat and dome covers.
Sockets Window for probing into cavity.
Engineering Kit Packages and lids for evalution.
CAD DXF, SAT, IGES, STEP and PDF drawings center.
Material Properties Df , Dk, ε , δ