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Open Cavity
Chip Package Solutions

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Assembly Wafer Foundry - MPW Publications Associations EDA Tools

Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding

M-QFN Series

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and bonding with Gold or aluminum wire.
•Excellent for rapid lab prototypes and pre-production.

Test Die Daisy Chain, RF Characterization, Steps, Shunts.

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electronica Nov 9~12 Munich, Germany - Hall A5.559