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Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•For engineering and rapid prototypes.
•Complies to JEDEC Standard MO-220 VQFN
Lids Flat and dome covers.
Sockets Window for probing into cavity.
Engineering Kit Packages and lids for evalution.
CAD DXF and PDF drawings center.
See us at the show:
May 2, 2012 ChipEx - Tel Aviv Israel
Nov 13-16, 2012 ELECTRONICA - Munich Germany
Exhibition Calendar
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