Open Cavity QFN
Rapid Prototyping
 
 
Products   Assembly   Contact   Bonding Wire    Sockets

 
Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding
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M-QFN Series

Open Cavity QFN Packages


Bonding Wire made by Tanaka
Bonding Wire

All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka

Test IC Socket by E-tec
IC Test Socket

Widest Range
Made by E-tec

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN

Lids Flat and dome covers.

QFN Sockets Window for probing into cavity.

Engineering Kit Packages and lids for evalution.

CAD DXF, SAT, IGES, STEP and PDF drawings center.

Material Properties Df , Dk, ε , δ

 

Exhibition Calendar



Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email: info@MirrorSemi.com


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