Open Cavity QFN
Rapid Prototyping
 
 
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Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding
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M-QFN Series

Open Cavity QFN Packages


Bonding Wire made by Tanaka
Bonding Wire

All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Preplated NiPdAu Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN

Lids Flat and dome covers.

Sockets Window for probing into cavity.

Engineering Kit Packages and lids for evalution.

CAD DXF, SAT, IGES, STEP and PDF drawings center.

Material Properties Df , Dk, ε , δ

 

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Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800
email: info@MirrorSemi.com


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