Open Cavity QFN Packages
All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka
Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Preplated NiPdAu Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN
Lids Flat and dome covers.
Sockets Window for probing into cavity.
Engineering Kit Packages and lids for evalution.
CAD DXF, SAT, IGES, STEP and PDF drawings center.
Material Properties Df , Dk, ε , δ