Open Cavity
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Air Cavity QFN with die and wire bonding
Enlarge  New F-QFN Series

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Gold or aluminum wire bondable.
•Excellent for rapid lab prototypes and pre-production.

  Open Cavity QFN

  More MirrorSemiTM Chip Packaging Solutions

Video Interview at IPC-Apex

 



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email: info@MirrorSemi.com

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