Open Cavity QFN
Rapid Prototyping

Read "End of Life" Notice Below
Products   Assembly   Contact   Bonding Wire

Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding
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M-QFN Series

Open Cavity QFN Packages

Bonding Wire made by Tanaka
Bonding Wire

All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka

End of Life Notice
Open cavity M-QFN Series suffix G5, G6 and G7 are scheduled for obsolescence. Not recommended for new designs. Packages will be available until finished goods inventory is depleted. Please inquire about replacement package with suffix G3 NiAu plating.

Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN

Lids Flat and dome covers.

Sockets Window for probing into cavity.

Engineering Kit Packages and lids for evalution.

CAD DXF, SAT, IGES, STEP and PDF drawings center.

Material Properties Df , Dk, ε , δ


Exhibition Calendar

Mirror Semiconductor, Inc.
17595 Harvard Ave, Suite 509
Irvine, CA 92614, USA
Tel: 1-866-404-8800

©2015 Mirror Semiconductor. All Rights Reserved.


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