Open Cavity QFN
Rapid Prototyping

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Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding
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M-QFN Series

40 open tooled NiPdAu preplated packages

Reasons to select preplated NiPdAu leadframes:

  • Superior die-bonding and wire-bonding.
  • Superior SMT board level solderablity.  
  • Similar characterization as mainstream.


  • Competitors use post-plated leadframes:
  • Problem: Dentrite entrapment under cavity wall.
  • Problem: Black pad SMT PCB soldering concerns.
  • Problem: Results don't correlate to industry practices.
  • Open Cavity (air cavity) QFN package:
    •MEMS, RF, sensor, and silicon applications.
    •Ready for die attach and wire bonding.
    •Preplated NiPdAu Cu alloy leadframes.
    •For engineering and rapid prototypes.
    •Complies to JEDEC Standard MO-220 VQFN

    Lids Flat and dome covers.

    Sockets Window for probing into cavity.

    Engineering Kit Packages and lids for evalution.

    CAD DXF, SAT, IGES, STEP and PDF drawings center.

    Material Properties Df , Dk, ε , δ

     

    See us at the show:
    July 8-10, 2014 SEMICON West - San Francisco - Booth 506
    Sept 30 ~ Oct 1, 2014 SMTA Int'l - Chicago - Booth 331
    Nov 11~14, 2014 Electronica - Munich, Germany

    More Exhibition Calendar



    Mirror Semiconductor, Inc.
    17595 Harvard Ave, Suite 509
    Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email: info@MirrorSemi.com


    ©2014 Mirror Semiconductor. All Rights Reserved.

     

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