OpenChipTM
Air Cavity QFN Packages
MEMS or Die
 
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  • Options and features to suit your specific packaging needs:
  • Stackable - PoP pads for mounting another QFN on top.
  • Mirrorable - Flip it over and mount upside down for Mirrored Pinout.
  • Testable - Top perimeter pads can be used as test points.
  • Optional Recessed Lid - B Stage flush lid securely encloses the package.
  • Optional Bare Die Pad -Please contact us for details
    •


    B-SQFN
  • PoP Stackable
  • Mirrorable
  • Heat Spreader
  • Recessed Lid
    		•
    Outline Drawing Top Bottom 3D Drawing
     
    A-SQFN
  • PoP Stackable
  • Mirrorable
  • Heat Spreader
  • Epoxy Fill
    		•
    Outline Drawing Top Bottom 3D Drawing
     
    B-QFN
  • Non-Stackable
  • Non-Mirrorable
  • Heat Spreader
  • Recessed Lid
    		•
    Outline Drawing Top Bottom 3D Drawing
     
    A-QFN
  • Non-Stackable
  • Non-Mirrorable
  • Heat Spreader
  • Epoxy Fill
    		•
    Outline Drawing Top Bottom 3D Drawing
     
     
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    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com

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