Open Cavity
Air Cavity QFN Packages
RF, MEMS & Semiconductor
 
 More Products    Lids    CCD Sensor Packaging    Assembly    Distributors    Home  
 

Open cavity (air cavity) organic semiconductor packages for quick-to-market applications. Excellent for fabless prototype, probing, RF, MEMS and sensor. Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Our organic packages can be delivered quickly. Faster than developing LTCC ceramic packages from scratch. Our soft-tooled packages are much cheaper than tooling injection molded packages. We fabricate quick-turn substrates and dispense liquid encapsulation to create the die cavity. Highly recommended for fabless prototyping and pre-production requirements.

Features to suit your specific packaging needs:
  • Available singulated for one-off assembly, or panelized array for step-and-repeat wire-bonding.
  • Die cavity 50 µ-inch (1.3 µm) plating for gold wire-bonding.
  • Bottom side is thin gold ENIG plated for optimum SMT RoHS lead-free soldering.
  • Standard package BT substrate.
  • RF Microwave Rogers RO4003C substrates optionally available.
  • Selecting Open Cavity QFN Check List.
  • Lid and Cap System Lids.
  • Open (Air) cavity package Catalog
    		•


    A-QFN Series
  • Singulated Device
  • Panelized Array
  • Wire Bondable
  • Epoxy Fill or Lid Cap
    		•  Click for QFN photo gallery
    Top Cavity    		 Click for QFN photo gallery
    Bottom SMT Mount    		 Click for rotatable model
    Use MS ie Browser
    Click Active-X
    3D Drawing
    Outline Drawing

    Array Outline    		 X-Wire Ready Photo Gallery Download eDrawings Viewer
    Bonding Pad Table

    Bonding Pad Outline    		 Panel Array

    Panel Dicing Instructions

    Panel Before Dicing    		 Vias in Die Pad

    Cavity Dam Material

    Cavity Fill Material    		 Download SAT File

    Download SAT Viewer
     
     
     
     
    A-QFN Top View A-QFN Bottom View

    A-QFN Open Cavity QFN
    Square Body (Standard Packages)
    N
    Leads    		 P
    Pitch    		 D/E
    Body    		 D1/E2
    Die Pad    		 Qty
    2" Waffle
    Pack    		 Qty
    Panel
    Array    		 Part Number Outline
    Drawing    		 Bonding
    Diagram
    All All All All All All A-QFN
    At-A-Glance    		 400010 400014
    8 0.65mm 3mm 1mm 100 256 A-QFN8W.65 460810 460814
    12 0.5mm 3mm 1mm 100 256 A-QFN12W.5 451210 451214
    12 0.65mm 4mm 2mm 64 144 A-QFN12W.65 461210 461214
    12 0.8mm 4mm 2mm 64 144 A-QFN12W.8 481210 481214
    16 0.5mm 3mm 1mm 100 256 A-QFN16W.5 451610 451614
    16 0.65mm 4mm 2mm 64 144 A-QFN16W.65 461610 461614
    16 0.8mm 5mm 3mm 36 81 A-QFN16W.8 481610 481614
    20 0.5mm 4mm 2mm 64 144 A-QFN20W.5 452010 452014
    20 0.65mm 5mm 3mm 36 81 A-QFN20W.65 462010 462014
    20 0.8mm 5mm 3mm 36 81 A-QFN20W.8 482010 482014
    24 0.5mm 4mm 2mm 64 144 A-QFN24W.5 452410 452414
    24 0.65mm 5mm 3mm 36 81 A-QFN24W.65 462410 462414
    24 0.8mm 6mm 4mm 25 64 A-QFN24W.8 482410 482414
    28 0.5mm 5mm 3mm 36 81 A-QFN28W.5 452810 452814
    28 0.65mm 6mm 4mm 25 64 A-QFN28W.65 462810 462814
    28 0.8mm 7mm 5mm 25 49 A-QFN28W.8 482810 482814
    32 0.5mm 5mm 3mm 36 81 A-QFN32W.5 453210 453214
    32 0.65mm 7mm 5mm 25 49 A-QFN32W.65 463210 463214
    32 0.8mm 8mm 6mm 16 36 A-QFN32W.8 483210 483214
    36 0.5mm 6mm 4mm 25 64 A-QFN36W.5 453610 453614
    40 0.5mm 6mm 4mm 25 64 A-QFN40W.5 454010 454014
    40 0.65mm 8mm 6mm 16 36 A-QFN40W.65 464010 464014
    44 0.5mm 7mm 5mm 25 49 A-QFN44W.5 454410 454414
    44 0.65mm 8mm 6mm 16 36 A-QFN44W.65 464410 464414
    48 0.5mm 7mm 5mm 25 49 A-QFN48W.5 454810 454814
    52 0.5mm 8mm 6mm 16 36 A-QFN52W.5 455210 455214
    56 0.5mm 8mm 6mm 16 36 A-QFN56W.5 455610 455614
    64 0.5mm 9mm 7mm 16 25 A-QFN64W.5 456410 456414
    68 0.5mm 10mm 8mm 9 25 A-QFN68W.5 456810 456814
    72 0.5mm 10mm 8mm 9 25 A-QFN72W.5 457210 457214
    80 0.5mm 12mm 10mm 9 16 A-QFN80W.5 458010 458014
    Standard Packaging: 2" Waffle Pack "W" in part#.     Example: A-QFN48W.5
    Optional Packaging: 4" Waffle Pack change  "W" to "P"     Example: A-QFN48P.5
    Optional Packaging: JEDEC Matrix Tray change  "W" to "T"     Example: A-QFN48T.5
    Standard semiconductor grade "BT" substrate: "no suffix"  Example: A-QFN48W.5
    Optional RF substrate: Rogers RO4003C: Add  "R" end of part#.     Example: A-QFN48W.5R
     
     
     
    Select the Correct Lid (Cross-Reference)
    QFN
    Series    		 QFN
    Dwg Nbr    		 QFN
    Description    		 QFN
    Pcode    		   Lid
    Series    		 Lid
    Dwg Nbr    		 Lid
    Description    		 Lid
    Pcode
    A-QFN 4xxxx0 Singulated
    Open Cavity
    0.635mm I.D.
    0.9mm O.D.    		 XH1   S-LID 2xxxx2 Singulated
    Flat Lid
    0.2mm Thick    		 XH9
    S-QFN 4xxxx2 Singulated
    Substrate
    0.2mm Thick
    Without cavity    		 XH0   A-CAP 2xxxx0 Singulated
    Cavity Cap
    0.635mm I.D.
    0.9mm O.D.    		 XH9
    AW-QFN 4xxxx6 Cavity Array
    60x60mm
    0.635mm I.D.
    0.9mm O.D.
    Unsawn    		 XH2   W-LID 2xxxx1 Array Lid
    Flat 60x60mm
    0.2mm Thick
    Unsawn    		 XH8
    AH-QFN 4xxxx5 Cavity Array
    50x50mm
    0.635mm I.D.
    0.9mm O.D.
    Partially Sawn    		 XH2   SH-LID 2xxxx4 Array Lid
    Flat 50x50mm
    Partially Sawn    		 XH8
    W-QFN 4xxxx1 Array Substrate
    60x60mm
    Without Cavity
    0.2mm Thick
    Unsawn    		 BP1   AH-CAP 2xxxx5 Cavity Array
    50x50mm
    Partially Sawn    		 XH8
    W-QFN 4xxxx1 Array Substrate
    60x60mm
    0.2mm Thick
    Unsawn    		 BP1   AW-CAP 2xxxx0 Cavity Array
    60x60mm
    With Cavity
    0.635mm I.D.
    0.9mm O.D.
    Unsawn    		 XH8
    Standard lid material is organic "BT" semiconductor grade.
    Optional RF lid material:     Rogers RO4003C: Add  "R" to end of lid part number.
     
     
     
     
     
    Part Numbering System
    A - QFN 28 W .8 Option Version
    Open Cavity   Model Leads Packaging Pitch (mm) Substrate Cavity Type
    A = Singulated
     
    AH = 50mm Array
    Partially Sawn

    AW = 60mm Array
    Requires Sawing    		   QFN = Quad
    DFN = Dual    		 Number
    Pins    		 W = 2" Waffle
    P = 4" Waffle
    T = JEDEC Tray    		 .4
    .5
    .65
    .8
    1.0
    1.27
    2.54    		 BT = Blank
    NL = NL Core
    R = RO-4003C    		 Standard = Blank

    Special 2~9
    Bare 0.2mm thick substrates are available without cavity build up. Use for making your own glob-top package:
    Bare 60mm Panelized Array: Change  "A" to "W".     Example: W-QFN48W.5
    Bare Singulated Substrate: Change  "A" to "S".     Example: S-QFN48W.5
     
     
     
    Drawing Numbering System
       4       5       48       1       0   
    Open Cavity
    Package    		 Pitch Pins Pad Design Singulated or Array
    4 = QFN
    Quad Sides

    5 = DFN
    Dual Sides    		 0 = None
    1 = 1.0mm
    2 = 1.27mm
    3 = 2.54mm
    4 = 0.4mm
    5 = 0.5mm
    6 = 0.65mm
    7 = Special
    8 = 0.8mm
    9 = Special    		 2 ~ 99 Standard Single Die:
    1=BT Substrate

    RF & Microwave:
    4=Rogers RO4003C


    Special Versions:
    2=Two Die Pads

    3=Multiple Die Pads 
    Multi-chip Module

    0=Bare Die Pad    		 Singulated Cavity Package:
    0 = A-QFN

    50mm Cavity Array:
    5 = AH-QFN
    (Partially sawn.
    Singulate using hand knife.)

    60mm Cavity Array:
    6 = AW-QFN
    (Unsawn Panel.
    Singulate with 12mil dicing blade)

    Non-Cavity Substrates:
    1 = W-QFN 60x60mm Array
    2 = S-QFN Singulated
     
    Packaging Codes
    Quantity
    QFN
    D/E
    Size    		 W
    2" Waffle    		 P
    4" Waffle    		 T
    JEDEC Tray    		 T
    Substrate Array
    3mm 100 306 490 256
    4mm 64 225 490 144
    5mm 36 144 490 81
    6mm 25 121 260 64
    7mm 25 81 260 49
    8mm 16 64 260 36
    9mm 16 49 260 25
    10mm 9 49 168 25
    12mm 9 36 189 16
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800 • Fax: 1-714-242-1770
    email to Info@MirrorSemi.com


    Top of Page
     
    Back to Products   Home