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Open cavity (air cavity) organic semiconductor packages for quick-to-market applications. Excellent for fabless prototype, probing, RF, MEMS and sensor. Use for R&D, laboratory projects and pre-production where low volume, low cost is required.
Our organic packages can be delivered quickly. Faster than developing LTCC ceramic packages from scratch. Our soft-tooled packages are much cheaper than tooling injection molded packages. We fabricate quick-turn substrates and dispense liquid encapsulation to create the die cavity. Highly recommended for fabless prototyping and pre-production requirements.
Features to suit your specific packaging needs:
Available singulated for one-off assembly, or panelized array for step-and-repeat wire-bonding.
Die cavity 50 µ-inch (1.3 µm) plating for gold wire-bonding.
Bottom side is thin gold ENIG plated for optimum SMT RoHS lead-free soldering.
Standard package BT substrate.
RF Microwave Rogers RO4003C substrates optionally available.
Selecting Open Cavity QFN Check List.
Lid and Cap System Lids.
Open (Air) cavity package Catalog
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