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CTE and Attributes for Open Cavity QFN |
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Open Cavity QFN
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| M-QFN (Open Cavity QFN) | |||
| Material | Brand-Moldel | Attributes | CTE |
| Molding Compound |
Sumitomo Bakelite EME-G770HD |
Dk 4.1 Dielectric Constant Df 0.005 Dissipation Factor Tg 130°C Pb Free • Br Free • Sb Free UL-94 V-0 Class |
α1 = 7x10-6/°C α2 = 34x10-6/°C |
| Lead Frame Base Alloy |
Olin C194 K65 ASTM Mat'l Nbr C194000 |
Cu97.45/Fe2.4/Zn.12/P.3 CuFe2P |
16.7x10-6/°C @25°C 17.5x10-6/°C @ 250°C |
| Surface Treatment Lead Frame |
Pre-plated NiPdAu |
Thickness: Ni 0.50~2.0µm Pd 0.02~0.15µm Au 0.003~0.015µm |
Ni 13x10-6/°C Pd 12x10-6/°C Au 12x10-6/°C α @ 25°C |
| Lids | |||
| Material | Brand-Moldel | Attributes | CTE |
| Ceramic | Alumina 92% Al2O3 |
Dk 8.9 Dielectric Constant |
X,Y,Z 7.4x10-6/°C |
| BT | HL832NS Mitsubishi |
Young's Modulus @ 25°C GPa 26 X,Y • 11 Z |
X,Y 12x10-6/°C Z 57x10-6/°C |
| Rogers | RO4003C Rogers |
Dk 3.38 Dielectric Constant Df 0.0027 Dissipation Factor |
X 11x10-6/°C Y 14x10-6/°C Z 46x10-6/°C |
