AE Adhesion Enhanced Die Attach Pad with Ni-Pd-Au-Plated Ring QFN Mirror Semiconductor

AE - Adhesion Enhanced
Leadframe
NiPdAu Ring Plated DAP

Optional AE (Adhesion Enhanced) DAP with plated ring offers the advantage of aggressive die adhesion compared with fully plated DAP (G6).

AE Advantage: Stronger adhesion of die to copper oxidized die attach pad (DAP).

AE Disdvantage: Cannot solder eutectic die to oxidized Cu DAP.

G6 Advantage: Fully plated DAP allows eutectic die bondng or standard die attach with adhesive compounds, paste and tape.

Features of AE and G6 Pad Advantages and Disadvantages
	AE Adhesion Enhanced Ring Plated DAP	G6 Fully Plated DAP
Eutectic Soldering Die with Metalized Backside	No	Yes
Die Attach Adhesive, paste, tape	Yes	Yes
Down Bonding Wire Bond to Ground	Yes	Yes
PPF Preplated NiPdAu Cu Lead Frame	Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.003 ~ 0.015µm	Ni 0.50 ~ 2.00µm Pd 0.02 ~ 0.15µm Au 0.003 ~ 0.015µm
Cavity Side Photo	AE Cavity Plated Ring	Fully Plated Cavity
Bottom Side Photo	Bottom Ground Pad Fully Plated	Bottom Ground Pad Fully Plated

Photos of AE (Adhesion Enhanced) Die Pad Click photos to enlarge.
AE Plated Ring 16L 3x3mm	AE Plated Ring 32L 5x5mm	AE 48L 7x7mm

See NiPdAu for more information about PPF preplated leadframe.

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