Open Cavity
Air Cavity QFN Packages
RF, MEMS & Semiconductor
 
 More Products    Lids    Sockets    Evaluation Kits    Chip Carriers    Assembly    Distributors    Home  
 

M-QFN Open cavity (air cavity) packages for quick-to-market applications.
Excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.
Singulated, ready for die attach and wire-bond.
Cover with lid or fill with glob-top.

Features to suit your specific packaging needs:
  • CAD Center DXF & PDF Drawings .
  • Customer Design Questionnaire .
  • Lid and Cap System Lids.
  • Open tooled packages.
  • Materials CTE  •  PDF   •   Plating: NiPdAu
  • Wire Bonding Photo Gallery
  • Package Part Numbering System
  • EAR99   •   RoHS Pb-Free   •   JEDEC MO-220 VQFN
    		•
     
    M-QFN Series - Open Cavity
    Top Cavity QFN - Click to Enlarge
    Top Cavity
    32L 5x5mm    		 Bottom View of QFN - Click to Enlarge
    Bottom Side
    32L 5x5mm    		 Construction:
  • Copper Lead Frame (C-194 F/H)
  • Plating: NiPdAu
  • G6 - Ni 0.50 ~ 2.00µm  • Pd 0.02 ~ 0.15µm  •  Au 0.003 ~ 0.015µm
  • G5 - Ni 1.27 ~ 4.57µm  •  Pd 0.15 ~ 0.51µm  •  Au 0.10 ~ 0.20µm
  • G3 - Ni 2.5 ~ 7.6µm  •  Au 1.0 ~ 2.0µm
    		•
    Top Cavity View - Click to Enlarge
    8L 3x3mm
    Pitch 0.65mm
    NiPdAu G5    		 Top Cavity View - Click to Enlarge
    12L 3x3mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity - Click to Enlarge
    16L 3x3mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity - Click to Enlarge
    16L 4x4mm
    Pitch 0.65mm
    NiPdAu G5    		 Top Cavity - Click to Enlarge
    20L 4x4mm
    Pitch 0.5mm
    NiPdAu G5    		 Top Cavity - Click to Enlarge
    24L 4x4mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity - Click to Enlarge
    32L 5x5mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity - Click to Enlarge
    40L 5x5mm
    Pitch 0.4mm
    NiPdAu G5
    Top Cavity - Click to Enlarge
    40L 6x6mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity - Click to Enlarge
    48L 6x6mm
    Pitch 0.4mm
    NiPdAu G5    		 Top Cavity - Click to Enlarge
    48L 7x7mm
    Pitch 0.5mm
    NiPdAu G6    		 Top Cavity View - Click to Enlarge
    56L 8x8mm
    Pitch 0.5mm
    NiPdAu G5    		 Top Cavity View - Click to Enlarge
    64L 9x9mm
    Pitch 0.5mm
    NiPdAu G5    		 Top Cavity - Click to Enlarge
    72L 10x10mm
    Pitch 0.5mm
    NiPdAu G5    		 Top Cavity - Click to Enlarge
    80L 12x12mm
    Pitch 0.5mm
    NiPdAu G5
     
     
    M-QFN Open (Air) Cavity QFN
    N
    Leads    		 P
    Pitch    		 D/E
    Body    		 D1/E2
    Die Pad    		 Plating
    Spec    		 Qty
    M-QFN
    2" Tray    		 Part Number
    Single Package    		 Outline
    Drawing    		 Rotatable
    360°
    Solidworks
    Model    		 Status
    8 0.65mm 3mm 1.4mm G5 100 M-QFN8W.65-G5 460850 Model Tooled
    12 0.5mm 3mm 1.4mm G6 100 M-QFN12W.5-G6 451260 Model Tooled
    16 0.5mm 3mm 1.4mm G6 100 M-QFN16W.5-G6 451660 Model Tooled
    16 0.65mm 4mm 2.4mm G5 64 M-QFN16W.65-G5 461650 Model Tooled
    20 0.5mm 4mm 2.4mm G5 64 M-QFN20W.5-G5 452050 Model Tooled
    24 0.5mm 4mm 2.4mm G6 64 M-QFN24W.5-G6 452460 Model Tooled
    32 0.5mm 5mm 3.4mm G6 36 M-QFN32W.5-G6 453260 Model Tooled
    40 0.4mm 5mm 3.4mm G5 36 M-QFN40W.4-G5 444050 Model Tooled
    40 0.5mm 6mm 4.4mm G6 25 M-QFN40W.5-G6 454060 Model Tooled
    48 0.4mm 6mm 4.4mm G5 25 M-QFN48W.4-G5 444850 Model Tooled
    48 0.5mm 7mm 5.4mm G6 25 M-QFN48W.5-G6 454860 Model Tooled
    56 0.5mm 8mm 6.0mm G5 16 M-QFN56W.5-G5 455650 Model Tooled
    64 0.5mm 9mm 7.0mm G5 16 M-QFN64W.5-G5 456450 Model Tooled
    72 0.5mm 10mm 8.0mm G5 9 M-QFN72W.5-G5 457250 Model Tooled
    80 0.5mm 12mm 10.0mm G5 9 M-QFN80W.5-G5 458050 Model Tooled
    Install Solidworks e-Drawings software Version 10.
    Required to view rotatable models:        PC Version  •  Mac Version
    Road Map Future Packages
     
     
    Package Part Numbering System
    M - QFN 16 W .5 - G6
    Cavity Type   Model Leads Packaging Pitch (mm) Option
    Cavity Package:
    M = Molded/Plastic
    Cu Leadframe (C-194F/H)
    Use flat Lid

    MA = Unsawn Cavity Array

    Substrate Package:
    S = Flat Cavity
    Ceramic RO4003C
    Use Dome Lid    		   QFN = Quad
    DFN = Dual    		 Number
    Pins    		 Standard:
    W = 2" Tray

    Optional:
    T = 4" Tray
    X = JEDEC Tray
    		 .4
    .5
    .65
    .8    		 M-QFN:
    G3 = Fully Plated Die Pad
    NiAu (Thick Gold)

    G5 = Fully Plated Die Pad
    NiPdAu (Thick Gold)

    G6 = Fully Plated Die Pad
    NiPdAu (Thin Gold)

    AE=Adhesion Enhanced
    Ring Plated Die Pad
    NiPdAu (Thin Gold)


    S-QFN Series:
    R = RO-4003C - Ceramic
    Plating NiAu or NiPdAu
    Click Lid part numbering system.
     
     
    Drawing Numbering System
       4       5       16       5       0   
    Open Cavity
    Package    		 Pitch Pins Plating & Construction Packaging
    4 = QFN
    Quad Sides

    5 = DFN
    Dual Sides    		 Standard:
    4 = 0.4mm
    5 = 0.5mm
    6 = 0.65mm
    8 = 0.8mm


    Special:
    0 = None
    1 = 1.0mm
    2 = 1.27mm
    3 = 2.54mm
    7 = Special
    9 = Special    		 8 ~ 99 Cu Lead Frame:
    5=Fully Plated Die Pad
    NiPdAu (Thick Gold)

    6=Fully Plated Die Pad
    NiPdAu (Thin Gold)

    7=Ring Plated AE Die Pad
    NiPdAu (Thin Gold)

    3=Fully Plated Die Pad
    NiAu (Thick Gold)




    Ceramic RF/Microwave:
    4=Rogers RO4003C
     8=Al2O3 LTCC


    Special Versions:
    0=Bare Cavity Floor
    1=One Die Pad
    2=Glass (Under Development)
    		 M-QFN:
    0 = 2" Waffle Tray (W)
    4 = 4" Waffle Tray (T)
    9 = JEDEC Tray (X)

     S-QFN:
    2 = 2" Waffle Tray

    Array 66m:
    (Under Development)
    1 = FA-QFN Cu L/F
    6 = MA-QFN Cu L/F

    Array 60mm:
    (Under Development)
     1 = W-QFN Flat Array
    6 = AW-QFN Dispensed Cavity
    5 = AH-QFN DispensedCavity
    Partially Sawn
     
    Packaging Codes
    Quantity
    QFN
    D/E
    Size    		 W
    2" Waffle
    Tray    		 T
    4" Waffle
    Tray    		 X
    JEDEC
    Matrix Tray    		 A
    Array
    Under Development
    3mm 100 306 490 289
    4mm 64 225 490 169
    5mm 36 144 490 121
    6mm 25 121 260 81
    7mm 25 81 260 64
    8mm 16 64 260 49
    9mm 16 49 260 36
    10mm 9 49 168 36
    12mm 9 36 189 25
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


    Top of Page
     
    Back to Products   Home
     
    M-QFN have matching footprints to OmPP and OCPP and Open-Pak OCP DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B ,