Open Cavity
Air Cavity QFN Packages
RF, MEMS & Semiconductor
 
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Open cavity (air cavity) semiconductor packages for quick-to-market applications.
Excellent for fabless prototype, probing, MEMS, RF-Microwave.
Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Features to suit your specific packaging needs:
  • Available singulated for one-off assembly, or array for step-and-repeat wire-bonding.
  • Customer Design Questionnaire .
  • Lid and Cap System Lids.
  • Open tooled packages.
    		•
     
    M-QFN Series
  • Singulated Device
  • Use With Flat Lid
    		•  Top Cavity View of QFN
    Top Cavity    		 Bottom View of QFN
    Bottom SMT Mount    		 Construction:
  • Copper Lead Frame
  • Pre-molded Cavity Ring
  • Plating Thickness:
      • Ni 0.50~2.00µm
      Pd 0.02~0.15µm
      Au 0.003~0.015µm
     
     
     
    M-QFN Open (Air) Cavity QFN
    N
    Leads    		 P
    Pitch    		 D/E
    Body    		 D1/E2
    Die Pad    		 Qty
    M-QFN
    2" Waffle Pack    		 Part Number
    Single Package    		 Outline
    Drawing    		 Rotatable
    360°
    Solidworks
    Model    		 Roadmap
    Status
    8 0.65mm 3mm 1.4mm 100 M-QFN8W.65 460850 - Q4-2010
    12 0.5mm 3mm 1.4mm 100 M-QFN12W.5 451250 - Q4-2010
    12 0.65mm 4mm 2.4mm 64 M-QFN12W.65 461250 - 2011
    12 0.8mm 4mm 2.4mm 64 M-QFN12W.8 481250 - 2011
    16 0.5mm 3mm 1.4mm 100 M-QFN16W.5 451650 Q4-2010
    16 0.65mm 4mm 2.4mm 64 M-QFN16W.65 461650 Q4-2010
    16 0.8mm 5mm 3.4mm 36 M-QFN16W.8 481650 - 2011
    20 0.4mm 3mm 1.4mm 100 M-QFN20W.4 442050 - 2011
    20 0.5mm 4mm 2.4mm 64 M-QFN20W.5 452050 - Q4-2010
    20 0.65mm 5mm 3.4mm 36 M-QFN20W.65 462050 - 2011
    20 0.8mm 5mm 3.4mm 36 M-QFN20W.8 482050 - 2011
    24 0.5mm 4mm 2.4mm 64 M-QFN24W.5 452450 - Q4-2010
    24 0.65mm 5mm 3.4mm 36 M-QFN24W.65 462450 - 2011
    24 0.8mm 6mm 4.4mm 25 M-QFN24W.8 482450 - 2011
    28 0.4mm 4mm 2.4mm 64 M-QFN28W.4 442850 - 2011
    28 0.5mm 5mm 3.4mm 36 M-QFN28W.5 452850 - 2011
    28 0.65mm 6mm 4.4mm 25 M-QFN28W.65 462850 - 2011
    28 0.8mm 7mm 5.4mm 25 M-QFN28W.8 482850 - 2011
    32 0.5mm 5mm 3.4mm 36 M-QFN32W.5 453250 Q4-2010
    32 0.65mm 7mm 5.4mm 25 M-QFN32W.65 463250 - 2011
    32 0.8mm 8mm 6.4mm 16 M-QFN32W.8 483250 - 2011
    36 0.4mm 5mm 3.4mm 36 M-QFN36W.4 443650 - 2011
    36 0.5mm 6mm 4.4mm 25 M-QFN36W.5 453650 - 2011
    40 0.4mm 5mm 3.4mm 36 M-QFN40W.4 444050 - Q4-2010
    40 0.5mm 6mm 4.4mm 25 M-QFN40W.5 454050 - Q4-2010
    40 0.65mm 8mm 6.4mm 16 M-QFN40W.65 464050 - 2011
    44 0.5mm 7mm 5.4mm 25 M-QFN44W.5 454450 - 2011
    44 0.65mm 8mm 6.4mm 16 M-QFN44W.65 464450 - 2011
    48 0.4mm 6mm 4.4mm 25 M-QFN48W.4 444850 - Q4-2010
    48 0.5mm 7mm 5.4mm 25 M-QFN48W.5 454850 Q4-2010
    52 0.5mm 8mm 6.4mm 16 M-QFN52W.5 455250 - 2011
    56 0.4mm 7mm 5.4mm 25 M-QFN56W.4 445650 - 2011
    56 0.5mm 8mm 6.0mm 16 M-QFN56W.5 455650 - Q4-2010
    64 0.4mm 7mm 5.4mm 25 M-QFN64W.4 446450 - 2011
    64 0.5mm 9mm 7.0mm 16 M-QFN64W.5 456450 - Q4-2010
    68 0.4mm 8mm 6.0mm 16 M-QFN68W.4 446850 - 2011
    68 0.5mm 10mm 8.0mm 9 M-QFN68W.5 456850 - 2011
    72 0.4mm 9mm 7.0mm 16 M-QFN72W.4 447250 - 2011
    72 0.5mm 10mm 8.0mm 9 M-QFN72W.5 457250 - Q4-2010
    76 0.4mm 9mm 7.0mm 16 M-QFN76W.4 447650 - 2011
    80 0.5mm 12mm 10.0mm 9 M-QFN80W.5 458050 - Q4-2010
    88 0.4mm 10mm 8.0mm 9 M-QFN88W.4 448850 - 2011
    100 0.4mm 12mm 10.0mm 9 M-QFN100W.4 449950 - 2011
    Install Solidworks e-Drawings software Version 10.
    Required to view rotatable models:        PC Version  •  Mac Version
     
     
     
    Select a Lid
    QFN
    Series    		 QFN
    Dwg Nbr    		 QFN
    Description    		 QFN
    Pcode    		   Lid
    Series    		 Lid
    Dwg Nbr    		 Lid
    Description    		 Lid
    Pcode
    M-QFN 4xxx50 Singulated
    Device    		 XH1   F-LID 2xxx52 Singulated
    Flat Lid    		 XH9
    MA-QFN 4xxx56 Array
    66x66mm
    Unsawn    		 XH2   FA-LID 2xxx51 Array Lid
    Flat 66x66mm
    Unsawn    		 XH8
    Standard lid:Organic semiconductor grade.
    Optional RF lid: Rogers RO4003C: Add  "R" to end of lid part number.
     
     
    Package Part Numbering System
    M - QFN 28 W .8 Option Version
    Cavity Type   Model Leads Packaging Pitch (mm) Substrate Material Customized
    Cavity Wall:
    M = Singulated (Sawn)
    MA = Unsawn 66mm Array

    Flat Substrate:
    F = Singulated Sawn
    FA = Array 66mm Unsawn
    S = Singulated RO-4003    		   QFN = Quad
    DFN = Dual    		 Number
    Pins    		 Standard:
    W = 2" Waffle

    Optional:
    P = 4" Waffle
    T = JEDEC Tray
    E = T&R    		 .4
    .5
    .65
    .8
    1.0
    1.27
    2.54    		 M-QFN & F-QFN Series:
    Cu (C-194 F/H) NiPdAu

    Blank=Fully Plated DAP
    B=Plated DAP Ring

    S-QFN Series:
    R = RO-4003C    		 Standard = Blank

    Special 2~9
    Click Lid part numbering system.
     
     
    Drawing Numbering System
       4       5       48       1       0   
    Open Cavity
    Package    		 Pitch Pins Pad Design Singulated or Array
    4 = QFN
    Quad Sides

    5 = DFN
    Dual Sides    		 0 = None
    1 = 1.0mm
    2 = 1.27mm
    3 = 2.54mm
    4 = 0.4mm
    5 = 0.5mm
    6 = 0.65mm
    7 = Special
    8 = 0.8mm
    9 = Special    		 2 ~ 99 Cu Lead Frame (NiPdAu):
    5=Fully Plated DAP
    7=Plated DAP Ring



    Special Versions:

    RF - Microwave:
    4=Rogers RO4003C

    0=Bare Cavity Floor
    1=BT - Single Die Pad
    2=Two Die Pads
    3=Multiple Die Pads
    6=Ceramic LTCC
    8=Special
    		 Singulated (Sawn):
    0 = M-QFN
    2 = S-QFN

    Array 66mm (Unsawn):
    1 = FA-QFN Cu L/F
    6 = MA-QFN Cu L/F

    Array 60mm (Unsawn):
    5 = AH-QFN Dispensed Dam
    1 = W-QFN Rogers
     
    Packaging Codes
    Quantity
    QFN
    D/E
    Size    		 W
    2" Waffle    		 P
    4" Waffle    		 T
    JEDEC Tray    		 P
    Array
    3mm 100 306 490 289
    4mm 64 225 490 169
    5mm 36 144 490 121
    6mm 25 121 260 81
    7mm 25 81 260 64
    8mm 16 64 260 49
    9mm 16 49 260 36
    10mm 9 49 168 36
    12mm 9 36 189 25
     

    Mirror Semiconductor
    17595 Harvard Ave, Suite 509, Irvine, CA 92614, USA
    Tel: 1-866-404-8800
    email to Info@MirrorSemi.com


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